
The Radius could reach R0.002
Overall waviness: 0.014μm
Surface quality could meet: 1nm
The included angle: 15 degree is OK
Diamond cutter for the infrared lens
Sharp cutting edge, the degree of finish can reach to 5nm on the work piece surface, overlong using life. Besides common specification, the least arc customization parameter we can accept is 2μm, the included angle 15 degree, the tools have 2 clearance angle in cylinder(Sketch one) and cone(Sketch Two)
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Diamond wafers have great potential in high-end fields such as quantum computing, microwave power devices, and semiconductor lasers due to their ultra-high hardness, excellent thermal conductivity, and wide bandgap properties.
Discover how our ceramic diamond grinding wheels enhance efficiency and precision in PCD chrome-plated workpiece machining. With optimized grinding processes, extended tool life, and improved surface finish, our solutions help manufacturers achieve higher productivity and lower costs.
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Tel: +86 17700605088