MCD (mono Crystal) Cutting Tool Application: 3C Industry
Tool arc: R10
Regrinding requirements: After 200 times magnification, the chipping of the tool is less than 2 microns
Grinding machine:M50 cnc grinding machine
Comparison:Moresuperhard W10 vitrified diamond grinding wheel and Internationally renowned brand diamond grinding wheel W10
| Brand | Grinding wheel grain sizes | Grinding allowance | Grinding paraments | Chipping | Grinding time |
| Moresuperhard | W10 | 0.055 | 0.01/5second | 0.015-0.02 | 7′36″ |
| Internationally renowned brand | W10 | 0.02 | 0.01/10second | 0.032 | 10分 |
Comparison chart before and after grinding by Moresuperhard W10 vitrified diamond grinding wheel
Before After
According to the grinding data, the processing parameters of Moao grinding wheel are to grind off 0.01mm allowance every 5 seconds, while it takes 10 seconds to grind off the 0.01mm allowance of foreign grinding wheel brands. The efficiency of Moao grinding wheel is twice as high as that of the peers, and the grinding time is 1/2 of the peers. It meets customer requirements, the overall effect exceeds customer expectations and helps customers reduce the cost of grinding.
Diamond wafers have great potential in high-end fields such as quantum computing, microwave power devices, and semiconductor lasers due to their ultra-high hardness, excellent thermal conductivity, and wide bandgap properties.
Discover how our ceramic diamond grinding wheels enhance efficiency and precision in PCD chrome-plated workpiece machining. With optimized grinding processes, extended tool life, and improved surface finish, our solutions help manufacturers achieve higher productivity and lower costs.
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