Vitrified bond diamond wheel for PCD peripheral grinding
Processing case：
1. Wheel size : 11A2-Ø200-W10-X10-H40
2. Wheel grit: D16 C125
3. Wheel speed :12M/S
4. Machine: EWAG Compact line
5. Press:feed on pressure at 130-140 Nm
6. coolant：Oil
7. Work life: 0.007mm/plate
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