Discover how our 3A1 ceramic diamond wheel helped a client achieve ultra-precise PCD reamer grinding. Learn how adjusting bond hardness and grit size resolved issues with carbide shank grinding for better edge quality and stability.
Diamond wafers have great potential in high-end fields such as quantum computing, microwave power devices, and semiconductor lasers due to their ultra-high hardness, excellent thermal conductivity, and wide bandgap properties.
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