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  • PCD Reamers External Grinding Case
    08 April 2025

    PCD Reamers External Grinding Case

    Discover how our 3A1 ceramic diamond wheel helped a client achieve ultra-precise PCD reamer grinding. Learn how adjusting bond hardness and grit size resolved issues with carbide shank grinding for better edge quality and stability.

  • Diamond wafer: the future star of the fourth-generation semiconductor materials
    03 April 2025

    Diamond wafer: the future star of the fourth-generation semiconductor materials

    Diamond wafers have great potential in high-end fields such as quantum computing, microwave power devices, and semiconductor lasers due to their ultra-high hardness, excellent thermal conductivity, and wide bandgap properties.

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  E-mail: pcd@moresuperhard.com